COB: The New Leader in the LED revolution.

In the field of LED display screens, the continuous advancement of display technology is driving the rapid development of the industry. In recent years, the technical term "COB" has frequently appeared in our field of vision and has become a new hot spot in the LED display industry. So, what exactly is a COB? Compared with mainstream SMD packaging technology, what advantages does it have?

1. ContrastCOB

LEDs and SMD LEDs show significant differences in contrast. Because the COB LED chip is smaller in size and uses a larger area of ​pure black coating, it can present deeper black and higher contrast. This black screen quality is not only deep, but also highly textured, bringing users a more extraordinary visual experience.

2. Viewing angle

In terms of viewing angles, SMD-encapsulated LED displays are prone to problems such as pitting and color shift when viewed from the side because the surface has not been optically processed. COB technology uses overall packaging to make the surface smooth and flat, and the viewing angle is wider both horizontally and vertically, providing users with better viewing effects.

3. Comfortability

COB LED uses a surface light source to emit light, which is non-glaring and has a short imaging distance, effectively shortening the viewing distance and making the display effect better. In contrast, SMD point light source imaging has obvious pixels when viewed at close range, which affects the imaging quality of the picture.

4. Protection

COB performs well in terms of protection. The surface of the light panel is fully sealed, and the front side reaches an IP65 protection level. It is waterproof, anti-static, and anti-scratch, and can even be wiped with water or alcohol. The lamp beads of SMD displays are easy to fall off or have dead pixels, and their surface protection is relatively weaker.

5. Stability

COB LED also has obvious advantages in stability. Its thermal path is short, LED is directly connected to PCB board, heat dissipation is fast, chip temperature rise is low, and reliability is better. In addition, COB packaging technology does not require wire bonding, which completely solves the problem SMD has caused by wire bonding. At the same time, the large spacing between chips greatly reduces the risk of failure caused by metal migration, achieving lower failure rate and more stable performance.

6.Applications

With the miniaturization of LED display screen dot pitch, the limitations and disadvantages of SMD technology are becoming increasingly prominent. COB technology, with its advantages of higher protection, higher display quality and higher reliability, has gradually become one of the mainstream technical options. At present, COB technology has been achieved on products with a minimum dot pitch of 0.4mm. In the future, combined with the development of Mini & Micro LED technology, COB will for sure lead LED display products into the era of micro pitch.

In summary, COB technology has shown superior performance than traditional SMD packaging technology in display effect, protection, stability and other aspects. With the continuous advancement of technology and the increasing maturity of the market, COB technology will become the mainstream trend of the LED display industry. In the future, we believe that COB technology will work together with Mini & Micro LED technology to take LED displays towards a brighter future.

HiGHSUN LED is a pioneer in the COB Movement. Please feel free to reach out to us at 214-919-5826 or email at usa@highsun-led.com.