COB costs are decreasing rapidly, and it is accelerating the replacement of traditional SMD LED displays!As people's requirements for display effects become more and more high-definition, "5G+8K ultra-high definition" continues to develop. In the LED display industry, small-pitch LEDs have also begun to continuously break through the upper limit of ultra-high-definition display. Small-pitch LEDs and even micro-pitch LED displays have become an inevitable trend in the

development of the industry.

COB was born in 2012. From the choice of international manufacturers to the participation of medium-sized manufacturers, the number of players has jumped from single digits to tens, which indirectly illustrates the market feasibility of COB.

The packaging technologies of LED displays mainly include DIP packaging technology, SMD packaging technology, IMD packaging technology, and COB technology. Among them, SMD packaging technology is mature and stable, with strong cost advantages, and is therefore the mainstream packaging technology in the current LED display industry.

Since SMD has good clarity and cost, and the technology is mature, why is COB replacing SMD?

The core driving force is two: the market's pursuit of better display effects is always there. COB has more obvious advantages in technology. Even if the cost is much higher than SMD now, it is difficult to stop COB from replacing SMD, just as SMD replaced DIP in the past.

Compared with other packaging technologies, COB technology is called "million-level technology", which means that in 1 million display pixels, products using COB technology can control the pixel failure points within 1-9. However, the pixel failure rate of SMD technology is only "ten thousand level", which is far from meeting the requirements of small pitch and ultra-high-definition display. Flip-chip COB technology can greatly increase the current density, improve the stability and light efficiency of lamp beads, and the flip-chip structure can well meet such needs, simplify the production process, and achieve better display effects. It can achieve chip-level spacing and has reached the level of Micro LED.

As a "million-level" packaging technology, COB technology not only helps display enter the p0.Xmm high-definition era, but also innovates the industrial chain with a new attitude. This is reflected in the fact that the layout of COB technology production process and production line equipment is very different from SMD packaging technology. COB technology integrates and simplifies the production process of packaging companies and display manufacturers, and the production process is easier to organize and control. In addition, COB technology has strong advantages in heat dissipation, effective use of space, moiré reduction, and post-maintenance.

Starting from 2023, with the continuous advancement of COB display technology, COB production technology is also constantly improving, production efficiency is improved, and production costs are reduced, resulting in a drop in COB prices. COB displays are being increasingly used in indoor high-end display scenarios. At present, the process of COB displays replacing LED displays is just like the process of SMD surface-mount LEDs replacing direct-plug displays. It is an iteration of technology and is unstoppable.